CFD Events Calendar, Event Record #13871
Testing Thermal Interface Material (TIM) Analysis
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This on-line presentation will provide an introduction to
the most commonly used Thermal Interface Material (TIM)
types and their corresponding testing techniques. Basic
TIM properties such as bulk or effective thermal
conductivity, interfacial thermal resistance and bond line
thickness will be explained.
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Date: |
March 10, 2011
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Location: |
http://www.mentor.com/products/mechanical/events/flotherm-tim-webinar
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Contact Email: |
design_simulation@mentor.com
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Organizer: |
Mentor Graphics
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Application Areas: |
Electronics Cooling
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Type of Event: |
Online Event, International
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Description: |
The presentation will begin with an overview of the
existing industrial and experimental test methods aimed at
measuring the thermal conductivity of these materials. The
ASTM D-5470 steady state TIM testing standard will then be
explained and evaluated.
In the second part of the presentation newly developed test
setups will be shown which mean an enhancement to the
existing standard, including a possible in-situ solution.
These new approaches will be explained in detail and
measurement results will be shown.
In the final part of the presentation the presenter will
discuss the importance of the evaluation of long term
reliability of these materials beside the highly precise
measurement of their thermal conductivity.
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Event record first posted on February 16, 2011, last modified on February 17, 2011
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