CFD Events Calendar, Event Record #30420
Printed Circuit Board(PCB) Design and Thermal Analysis
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Learn how to improve stress, deformation and thermal
simulations of electronics by adopting accurate material
models
Discover how to avoid issues during or after manufacturing
of electronics
Review methods to ensure manufactured electronics meet
quality requirements
|
Date: |
March 3, 2022
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Location: |
https://mpages.mscsoftware.com/Electronics_Webinar_IPAC_LP-Registration.html
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Organizer: |
Hexagon
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Application Areas: |
Electronics Cooling
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Softwares: |
Cradle
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Type of Event: |
Online Event, International
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Description: |
Modern electronic devices have a very high mounting density
and power consumption. Recent developments in the
electronics industry have caused size reduction of the
electronic components. Smaller components result in a
substantial heat flow towards the Printed Circuit Boards
(PCB). Therefore, there is a dire need for an exhaustive
study on the design and manufacturing process of a PCB using
a virtual prototype. Proper analysis before releasing the
physical prototype can save costs, increase customer
satisfaction, and prevent board failures.
Benefits of Attending:
Learn how to improve stress, deformation and thermal
simulations of electronics by adopting accurate material
models
Discover how to avoid issues during or after manufacturing
of electronics
Review methods to ensure manufactured electronics meet
quality requirements
Come and join us for this webinar to quench your
intellectual curiosity.
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Event record first posted on February 25, 2022, last modified on February 27, 2022
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