2006 Icepak Summit
May 22-23, 2006 - Monterey, CA

This event is for engineers and managers looking to share ideas on how to enhance the use of thermal modeling within their electronics cooling design processes. Come and see the newest applications and approaches using Icepak, Icepro, Iceboard, Icechip, and Icewave. Learn about upcoming developments in these products, as well as new products that will be released in the coming months.

The Icepak Summit will be held in conjunction with the Fluent CFD Summit so there will be multiple opportunities for participants to interact with other members of the Icepak and larger Fluent communities. You will be able to share your experience with others who use simulation as part of their design efforts, as well as connect with industry colleagues, visionaries, and Fluent staff. In addition, leading software and hardware vendors will be available to discuss, display, and demonstrate offerings that complement our product set and your hardware requirements during the CFD Pavilion.